WEICON C is a temperature-resistant and flowable epoxy resin system especially for industrial use. The adhesive is non-corrosive, anti-magnetic and cures practically without shrinkage. WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out moulds and for the production of fixing devices and tools (e.g. injection moulds). It can be used in the tool and mould making sector as well as in many other industrial areas subjected to high thermal stress.